ES Systems has developed a series of board mountable pressure sensors targeting a variety of markets requiring high resolution and accuracy for absolute, gauge or differential pressure measurements. The ESCP-BMS1 is a MEMS capacitive pressure sensor with state-of-theart performance. The MEMS pressure sensor die is underpinned by ES’ innovative SOI-surface micromachining technology.
ESCP-BMS1 is an absolute, gauge or differential pressure sensor of ultrahighresolution with analog (0-3,3V), PWM, SPI or I2C interface. The output is fully calibrated, and temperature compensated based on the internal temperature sensor and the factory calibration coefficients which are stored in the embedded memory. The sensor is ready to be installed directly to the end system without further processing. The total error including repeatability, hysteresis, non-linearity, thermal offset and calibration error between 0oC and 60oC is better than 0.25% FS.
Different power modes are available enabling low power operation, while the output rate and thus the conversion speed is programmable allowing the end user to customize/optimize performance. The sensor can be configured to provide both high accuracy 32-bit pressure and temperature outputs.
ESCP-BMS1 is a silicon capacitive pressure sensor with excellent longterm stability. The sensor is incorporated in a standard 8-pin DIP package with a single or two pneumatic ports. The top port is the high side and the bottom port is the low side.